The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 11, 2017

Filed:

Oct. 23, 2014
Applicant:

Kyocera Corporation, Kyoto-shi, Kyoto, JP;

Inventor:

Kensaku Murakami, Kyoto, JP;

Assignee:

KYOCERA CORPORATION, Kyoto-Shi, Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/498 (2006.01); H05K 3/40 (2006.01); H01L 23/00 (2006.01); H01L 33/62 (2010.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49811 (2013.01); H01L 23/49805 (2013.01); H01L 23/49838 (2013.01); H01L 24/05 (2013.01); H05K 3/403 (2013.01); H01L 33/62 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/48227 (2013.01); H01L 2924/181 (2013.01); H05K 3/4629 (2013.01); H05K 2201/09036 (2013.01); H05K 2201/0969 (2013.01); H05K 2201/09145 (2013.01);
Abstract

This wiring board is provided with: an insulating base that has a lateral surface having an incision part; an electrode that is provided on the inner surface of the incision part; and a wiring conductor that is provided within the insulating base or on the surface of the insulating base and is electrically connected to the electrode via a connection conductor. The width of the incision part is larger than the depth thereof, and the connection conductor is connected to the electrode at an end of the incision part in the width direction. An electronic device according to the present invention is provided with this wiring board and an electronic component that is mounted to the upper surface of this wiring board.


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