The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 11, 2017
Filed:
Sep. 02, 2015
Research & Business Foundation Sungkyunkwan University, Suwon-si, KR;
Joon-Sung Yang, Seongnam-si, KR;
Hyunseung Han, Seoul, KR;
Research & Business Foundation Sungkyunkwan University, Suwon-si, KR;
Abstract
A three-dimensional (3D) integrated circuit (IC) includes a plurality of through silicon vias (TSVs) configured to provide paths via which digital signals are transmitted or received; at least one redundant TSV configured to provide a path via which a digital signal to be transmitted or received via a failed TSV with a defect among the plurality of TSVs is transmitted or received; a digital-to-analog converter (DAC) configured to convert a digital signal transmitted via the at least one redundant TSV into an analog signal; an analog-to-digital converter (ADC) configured to convert an analog signal received via the at least one redundant TSV into a digital signal; and a multilevel modulator configured to perform multilevel modulation on a digital signal transmitted via the at least one redundant TSV.