The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 11, 2017
Filed:
Oct. 29, 2015
Applicant:
Seiko Instruments Inc., Chiba-shi, Chiba, JP;
Inventors:
Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 21/336 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 29/06 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3178 (2013.01); H01L 21/563 (2013.01); H01L 29/0657 (2013.01); H01L 23/562 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/92125 (2013.01);
Abstract
Provided is a flip-chip mounted semiconductor device in which a crack is less likely to develop. Flip chip mounting is carried out under the condition that no oxide film exists on the scribe region so as to eliminate the interface between the oxide film that remains on the scribe region and the silicon substrate from which a crack may develop. As a result, the circuit board, the encapsulant, and the silicon substrate are stacked at an end portion of the semiconductor chip.