The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 11, 2017
Filed:
May. 04, 2015
Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-fu, JP;
Yoshiharu Suemori, Nagaokakyo, JP;
Murata Manufacturing Co., Ltd., Kyoto, JP;
Abstract
An electronic component module includes a substrate, an electronic component mounted on the substrate, and a resin sealing portion that seals the electronic component and covers a principal surface of the substrate. The resin sealing portion includes a film-shaped resin layer that covers upper and side surfaces of the electronic component and the principal surface of the substrate, and an embedding resin layer that covers the film-shaped resin layer. The embedding resin layer has a smaller coefficient of linear expansion than that of the film-shaped resin layer. A portion of the film-shaped resin layer covering the side surfaces has a smaller thickness than either of a thickness of a portion of the film-shaped resin layer covering the upper surface and a thickness of a portion of the film-shaped resin layer covering the principal surface.