The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 11, 2017
Filed:
Nov. 03, 2014
Applicant:
James Jen-ho Wang, Phoenix, AZ (US);
Inventor:
James Jen-Ho Wang, Phoenix, AZ (US);
Assignee:
Other;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05B 37/00 (2006.01); H05B 39/00 (2006.01); H05B 41/00 (2006.01); H01F 41/02 (2006.01); H05B 33/08 (2006.01); H05K 1/16 (2006.01); H05K 3/46 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01); H05K 3/00 (2006.01); H05K 3/28 (2006.01); H05K 3/42 (2006.01);
U.S. Cl.
CPC ...
H01F 41/0206 (2013.01); H05B 33/0803 (2013.01); H05B 33/0821 (2013.01); H05B 33/0845 (2013.01); H05K 1/028 (2013.01); H05K 1/0283 (2013.01); H05K 1/165 (2013.01); H05K 3/4697 (2013.01); H05K 1/021 (2013.01); H05K 1/0209 (2013.01); H05K 1/0271 (2013.01); H05K 1/189 (2013.01); H05K 3/0005 (2013.01); H05K 3/0035 (2013.01); H05K 3/0061 (2013.01); H05K 3/0097 (2013.01); H05K 3/281 (2013.01); H05K 3/427 (2013.01); H05K 2201/056 (2013.01); H05K 2201/086 (2013.01); H05K 2201/0919 (2013.01); H05K 2201/09672 (2013.01); H05K 2201/09709 (2013.01); H05K 2201/09845 (2013.01); H05K 2203/0126 (2013.01); H05K 2203/0384 (2013.01); H05K 2203/0571 (2013.01); H05K 2203/063 (2013.01); H05K 2203/1545 (2013.01);
Abstract
An embedded deviceis assembled within a flexible circuit assemblywith the embedded device mid-plane intentionally located in proximity to the flexible circuit assembly central planeto minimize stress effects on the embedded device. The opening, for the embedded device, is enlarged in an intermediate layerto enhance flexibility of the flexible circuit assembly.