IDiyas

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9704639 B1

PDFFull Text
Date of Patent:
Jul. 11, 2017

Filed:

Nov. 07, 2014

Non-planar inductive electrical elements in semiconductor package lead frame

Applicant:

Solantro Semiconductor Corp., Ottawa, CA;

Inventors:

Raymond Kenneth Orr, Kanata, CA;

James Benson Bacque, Ottawa, CA;

Mark Roy Harris, Woodlawn, CA;

Assignee:

Solantro Semiconductor Corp., Ottawa, Ontario, CA;

Attorney:

Barnes & Thornburg LLP

Primary Examiner:

Marvin Payen

Assistant Examiner:

Jeremy Joy

Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/64 (2006.01); H01L 23/48 (2006.01); H01F 27/28 (2006.01); H01L 23/00 (2006.01); H01L 21/48 (2006.01); H01F 27/29 (2006.01); H01F 27/30 (2006.01); H01L 23/522 (2006.01); H01L 23/66 (2006.01);
U.S. Cl.
CPC ...
H01F 27/2804 (2013.01); H01F 27/29 (2013.01); H01F 27/303 (2013.01); H01L 21/4842 (2013.01); H01L 23/495 (2013.01); H01L 23/4951 (2013.01); H01L 23/4952 (2013.01); H01L 23/49537 (2013.01); H01L 23/49541 (2013.01); H01L 23/49551 (2013.01); H01L 23/49575 (2013.01); H01L 23/5227 (2013.01); H01L 23/645 (2013.01); H01L 23/66 (2013.01); H01L 24/49 (2013.01); H01L 24/85 (2013.01); H01F 2027/2819 (2013.01); H01L 23/49544 (2013.01); H01L 2224/48177 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/173 (2013.01); H01L 2924/1711 (2013.01); H01L 2924/1715 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/30107 (2013.01);
Abstract

The present disclosure relates to non-planar inductive electrical elements in semiconductor package lead frames. A non-planar inductive element is formed from a lead frame in a semiconductor package. The semiconductor package also includes at least one semiconductor die coupled to the lead frame. The non-planar inductive element could be formed by deforming portions of a patterned planar lead frame blank to form the non-planar inductive element in a deformed lead frame blank. The deformed lead frame blank and the at least one semiconductor die could then be packaged into a semiconductor package. A setting tool could be used to deform the lead frame blank. A configurable lead frame blank could be configurable into any of a variety of inductive elements, through interconnection of lead frame segments using wire bonds, for example.

Find Patent Forward Citations

Loading…