The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 11, 2017
Filed:
Jul. 30, 2015
Applicant:
Fujitsu Limited, Kawasaki-shi, Kanagawa, JP;
Inventors:
Hiroyasu Kawano, Ebina, JP;
Kazuyuki Ozaki, Machida, JP;
Assignee:
FUJITSU LIMITED, Kawasaki, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06K 19/077 (2006.01); H01L 23/373 (2006.01); G06K 19/07 (2006.01); G06K 19/02 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01); H01L 23/34 (2006.01);
U.S. Cl.
CPC ...
G06K 19/0773 (2013.01); G06K 19/02 (2013.01); G06K 19/0716 (2013.01); G06K 19/07775 (2013.01); H01L 23/293 (2013.01); H01L 23/3107 (2013.01); H01L 23/34 (2013.01); H01L 23/3735 (2013.01); H01L 2924/0002 (2013.01);
Abstract
A package structure includes a first member that surrounds a semiconductor device, a heat insulating material that surrounds an outer side of the first member, and a second member that surrounds an outer side of the head insulating material. The heat insulating material has a density and a thermal conductivity lower than those of the first and second members. The first member has a heat capacity larger than that of the second member.