The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 11, 2017

Filed:

Nov. 11, 2014
Applicant:

Lenovo Enterprise Solutions (Singapore) Pte. Ltd., Singapore, SG;

Inventors:

Michael Decesaris, Carrboro, NC (US);

Luke D. Remis, Raleigh, NC (US);

John K. Whetzel, Holly Springs, NC (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 31/26 (2014.01); G01R 31/02 (2006.01); G01R 31/303 (2006.01); G06F 11/07 (2006.01); G06F 11/263 (2006.01);
U.S. Cl.
CPC ...
G06F 11/0793 (2013.01); G01R 31/303 (2013.01); G06F 11/0706 (2013.01); G06F 11/0751 (2013.01); G06F 11/079 (2013.01);
Abstract

An electronic system comprises: a pin sensor; and an integrated management module, wherein the integrated management module: identifies a location of a damaged connector between a semiconductor chip and a hardware socket, wherein the location of the damaged connector is described by one or more readings from the pin sensor, and wherein the damaged connector prevents a particular signal from being supplied to the semiconductor chip via the hardware socket; identifies the particular signal as an input for a particular semiconductor function; determines whether the semiconductor chip provides the particular semiconductor function; and adjusts a use of the semiconductor chip based on whether or not the semiconductor chip uses the particular signal to provide the particular semiconductor function.


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