The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 11, 2017

Filed:

Apr. 26, 2012
Applicants:

Takashi Okazaki, Tokyo, JP;

Akira Ishibashi, Tokyo, JP;

Sangmu Lee, Tokyo, JP;

Takuya Matsuda, Tokyo, JP;

Inventors:

Takashi Okazaki, Tokyo, JP;

Akira Ishibashi, Tokyo, JP;

Sangmu Lee, Tokyo, JP;

Takuya Matsuda, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F25B 39/02 (2006.01); F28F 1/12 (2006.01); F24F 13/30 (2006.01); F24F 1/00 (2011.01); F28D 1/047 (2006.01); F28F 1/02 (2006.01); F28F 1/32 (2006.01); F25B 1/00 (2006.01); F25B 13/00 (2006.01); F28D 1/02 (2006.01);
U.S. Cl.
CPC ...
F28F 1/12 (2013.01); F24F 1/0007 (2013.01); F24F 13/30 (2013.01); F25B 1/005 (2013.01); F25B 13/00 (2013.01); F25B 39/028 (2013.01); F28D 1/0478 (2013.01); F28F 1/022 (2013.01); F28F 1/32 (2013.01); F25B 2313/006 (2013.01); F25B 2313/02741 (2013.01); F25B 2341/0661 (2013.01); F28D 1/0471 (2013.01); F28D 1/0476 (2013.01); F28D 2001/0273 (2013.01);
Abstract

The heat exchanger includes heat exchange units. Each of the heat exchange units includes a plurality of plate fins and a plurality of flat tubes. The plate fins are arranged spaced apart from one another at intervals so as to allow air to flow therebetween. The flat tubes each have an L shape by bending and inserted through the plate fins so that a refrigerant flows therethrough in a direction in which the plate fins are arranged. The heat exchange units are combined to each other so as to form a rectangular shape. Thus, heat exchange can be efficiently performed by increasing the mounting area.


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