The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 11, 2017

Filed:

Sep. 29, 2014
Applicant:

Lg Chem, Ltd., Seoul, KR;

Inventors:

Gi Cheul Kim, Daejeon, KR;

Sang Gi Lee, Daejeon, KR;

Kyu Pal Kim, Daejeon, KR;

Sung Soo Park, Daejeon, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08F 2/46 (2006.01); C08F 2/50 (2006.01); C08G 61/04 (2006.01); C08F 2/10 (2006.01); C08J 3/075 (2006.01); C08F 2/48 (2006.01); C08F 6/00 (2006.01); C08L 101/14 (2006.01); C08F 220/18 (2006.01);
U.S. Cl.
CPC ...
C08F 2/50 (2013.01); C08F 2/10 (2013.01); C08F 2/48 (2013.01); C08F 6/008 (2013.01); C08F 220/18 (2013.01); C08J 3/075 (2013.01); C08L 101/14 (2013.01);
Abstract

This disclosure relates to a method for preparing super absorbent polymer. The method for preparing super absorbent polymer according to the present invention comprises the steps of performing photopolymerization of a monomer composition comprising water soluble ethylene unsaturated monomers, a thermal polymerization initiator and a photopolymerization initiator at a temperature of 30 to 55° C.; performing a thermal polymerization and a photopolymerization at a temperature of 55 to 120° C. to form a hydrogel polymer; and drying the hydrogel polymer. According to the present invention, by comprising two polymerization steps including performing photopolymerization at low temperature and then performing thermal polymerization or photopolymerization at high temperature, super absorbent polymer having improved physical properties may be obtained.


Find Patent Forward Citations

Loading…