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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9701119 B1

PDFFull Text
Date of Patent:
Jul. 11, 2017

Filed:

Jun. 12, 2014

Fluid ejection chip including hydrophilic and hydrophopic surfaces and methods of forming the same

Applicant:

Funai Electric Co., Ltd., Osaka, JP;

Inventors:

David C. Graham, Lexington, KY (US);

David B. Rhine, Georgetown, KY (US);

Sean T. Weaver, Union, KY (US);

Christopher A. Craft, Paris, KY (US);

Assignee:

Funai Electric Co., Ltd., Osaka, JP;

Attorney:

Amster, Rothstein & Ebenstein, LLP

Primary Examiner:

Lisha Jiang

Int. Cl.
CPC ...
B41J 2/135 (2006.01); B41J 2/14 (2006.01); B41J 2/16 (2006.01); B05D 5/04 (2006.01); C23C 16/04 (2006.01); C23C 16/40 (2006.01); B05D 5/08 (2006.01); B05D 1/32 (2006.01);
U.S. Cl.
CPC ...
B41J 2/1433 (2013.01); B41J 2/1606 (2013.01); C23C 16/045 (2013.01); C23C 16/401 (2013.01); C23C 16/403 (2013.01); B05D 1/32 (2013.01); B05D 5/08 (2013.01);
Abstract

A fluid ejection chip and associated methods of forming are disclosed. According to an exemplary embodiment, the fluid ejection chip comprises a substrate, a flow feature layer, and a nozzle layer. The flow feature layer is disposed over the substrate and has an exposed hydrophilic surface layer with an ink contact angle of about 80 degrees. The nozzle layer is disposed over the flow feature layer and has a thickness of about 4 microns to about 8 microns and an exposed hydrophobic surface layer having an ink contact angle of about 115 degrees.

Find Patent Forward Citations

Graham, David. (2017). Fluid ejection chip including hydrophilic and hydrophopic surfaces and methods of forming the same (U.S. Patent No. 9701119). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9701119

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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