The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 11, 2017
Filed:
May. 02, 2014
Applicant:
The Procter & Gamble Company, Cincinnati, OH (US);
Inventors:
Kevin Benson McNeil, Loveland, OH (US);
Patrick John Buschur, Fairfield, OH (US);
Andre Mellin, Amberley Village, OH (US);
Thomas Timothy Byrne, West Chester, OH (US);
Mark Stephen Conroy, Colerain Township, OH (US);
Assignee:
The Procter & Gamble Company, Cincinnati, OH (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
D21H 27/40 (2006.01); B32B 37/30 (2006.01); B32B 5/26 (2006.01); D21H 27/00 (2006.01); D21H 27/02 (2006.01); D21H 27/30 (2006.01); B32B 5/02 (2006.01); B32B 5/08 (2006.01); B32B 5/22 (2006.01); B32B 7/14 (2006.01); B32B 29/00 (2006.01); B32B 29/06 (2006.01);
U.S. Cl.
CPC ...
B32B 37/30 (2013.01); B32B 5/02 (2013.01); B32B 5/08 (2013.01); B32B 5/22 (2013.01); B32B 5/26 (2013.01); B32B 7/14 (2013.01); B32B 29/005 (2013.01); B32B 29/06 (2013.01); D21H 27/004 (2013.01); D21H 27/02 (2013.01); D21H 27/30 (2013.01); D21H 27/40 (2013.01); B32B 2250/20 (2013.01); B32B 2250/26 (2013.01); B32B 2262/0223 (2013.01); B32B 2262/0253 (2013.01); B32B 2262/0261 (2013.01); B32B 2262/0276 (2013.01); B32B 2262/04 (2013.01); B32B 2262/06 (2013.01); B32B 2262/12 (2013.01); B32B 2307/54 (2013.01); B32B 2307/718 (2013.01); B32B 2307/72 (2013.01); B32B 2555/00 (2013.01); Y10T 428/15 (2015.01); Y10T 428/24463 (2015.01); Y10T 428/24562 (2015.01); Y10T 428/24612 (2015.01); Y10T 428/24826 (2015.01);
Abstract
Embossed multi-ply fibrous structures and methods for making such embossed multi-ply fibrous structures are provided.