The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 11, 2017

Filed:

Nov. 13, 2013
Applicant:

Cooper Tire & Rubber Company, Findlay, OH (US);

Inventor:

Randall L. Tucker, Findlay, OH (US);

Assignee:

COOPER TIRE & RUBBER COMPANY, Findlay, OH (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06K 19/06 (2006.01); B29D 30/00 (2006.01); G06K 19/077 (2006.01); B60C 5/00 (2006.01); B60C 23/04 (2006.01); H01Q 1/22 (2006.01); H01Q 9/28 (2006.01);
U.S. Cl.
CPC ...
B29D 30/0061 (2013.01); B60C 5/00 (2013.01); B60C 23/0452 (2013.01); B60C 23/0493 (2013.01); G06K 19/0779 (2013.01); G06K 19/07764 (2013.01); G06K 19/07786 (2013.01); H01Q 1/2225 (2013.01); H01Q 1/2241 (2013.01); H01Q 9/28 (2013.01); B29D 2030/0066 (2013.01); B29D 2030/0077 (2013.01); Y10T 29/4902 (2015.01); Y10T 152/10495 (2015.01);
Abstract

A product such as a tire includes a radio frequency identification device (RFID) assembly located along an outer sidewalk The RFID assembly has a thin, flexible, substantially planar, elongated non-conductive rubber, elastomer, or polymer substrate. First and second thin, flexible, elongated, substantially planar first antenna portions formed at least in part of the same conductive rubber, elastomer, or polymer are provided on the substrate. Opposite first and second ends of the first antenna portion have different first and second widths. A chip has opposite first and second ends in operative electrical connection with the first and second antenna portions, respectively, and is located between the outer sidewall and the substrate.


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