The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 11, 2017
Filed:
Oct. 30, 2013
Applicant:
General Electric Company, Schenectady, NY (US);
Inventor:
Gregory Scot Corman, Ballston Lake, NY (US);
Assignee:
General Electric Company, Niskayuna, NY (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C03B 29/00 (2006.01); C04B 37/00 (2006.01); B29C 73/00 (2006.01); B29C 65/00 (2006.01); B32B 37/00 (2006.01); B65C 9/25 (2006.01); B29C 73/16 (2006.01); B23P 6/04 (2006.01); B29C 73/02 (2006.01); F01D 5/00 (2006.01); C04B 41/85 (2006.01); C04B 41/00 (2006.01); C04B 41/50 (2006.01); B23P 6/00 (2006.01);
U.S. Cl.
CPC ...
B29C 73/00 (2013.01); B23P 6/045 (2013.01); B29C 73/02 (2013.01); B29C 73/16 (2013.01); C04B 41/009 (2013.01); C04B 41/5096 (2013.01); C04B 41/85 (2013.01); F01D 5/005 (2013.01); B23P 6/002 (2013.01); B23P 6/04 (2013.01);
Abstract
A method of repairing matrix microcracks in MI-CMC components includes heating 'free' silicon phase present within the cracked matrix portion of the component to a temperature above the melting point of the silicon phase. During heating of the component an additional source of silicon phase is supplied to the component. The atmosphere about the component is controlled during the heating of the component. The MI-CMC component is cooled below the melting point of the silicon phase to cool and solidify the silicon phase that has migrated into the microcracks to thereby bond the crack faces together.