The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9701050 B1

PDF
Full Text
Expired
Date of Patent:
Jul. 11, 2017

Filed:

Aug. 11, 2014
Applicant:

Toyota Boshoku Kabushiki Kaisha, Aichi-ken, JP;

Inventor:

Hideo Kamiya, Aichi, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 45/14 (2006.01); B29K 23/00 (2006.01); B29K 77/00 (2006.01); B29K 105/08 (2006.01);
U.S. Cl.
CPC ...
B29C 45/14221 (2013.01); B29C 45/14786 (2013.01); B29K 2023/12 (2013.01); B29K 2077/00 (2013.01); B29K 2105/0872 (2013.01);
Abstract

A method of manufacturing a resin molded member having a recess includes a press molding process and an injection molding process. The press molding process includes placing a flat plate shaped molding material containing fibers and a thermoplastic resin between dies in pair one having a die projection and another having a die recess, moving at least one of the dies, cutting the molding material by a shearing action of the dies caused by the moving, and pressing the molding material between the dies by the moving. The injection molding process includes injecting a melted resin into a molding space that is formed between the dies after the cutting of the molding material, and molding a wall portion having the recess out of the injected resin so as to be integral with at least one part of the molding material that is cut off in the cutting.


Find Patent Forward Citations

Kamiya, Hideo. (2017). Method of manufacturing resin molded member (U.S. Patent No. 9701050). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9701050

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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