The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 11, 2017

Filed:

Mar. 29, 2010
Applicants:

Julien Venturini, Paris, FR;

Bruno Godard, Les Ulis, FR;

Cyril Dutems, Colombes, FR;

Marc Bucchia, Herblay, FR;

Inventors:

Julien Venturini, Paris, FR;

Bruno Godard, Les Ulis, FR;

Cyril Dutems, Colombes, FR;

Marc Bucchia, Herblay, FR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); B23K 26/00 (2014.01); H01L 21/268 (2006.01); B23K 26/04 (2014.01); B23K 26/073 (2006.01); B23K 26/08 (2014.01); G03F 7/20 (2006.01); B23K 26/40 (2014.01); H01L 23/525 (2006.01); B23K 101/40 (2006.01); B23K 103/00 (2006.01);
U.S. Cl.
CPC ...
B23K 26/0066 (2013.01); B23K 26/0006 (2013.01); B23K 26/04 (2013.01); B23K 26/073 (2013.01); B23K 26/08 (2013.01); B23K 26/40 (2013.01); G03F 7/70383 (2013.01); H01L 21/02354 (2013.01); H01L 21/02678 (2013.01); H01L 21/268 (2013.01); B23K 2201/40 (2013.01); B23K 2203/50 (2015.10); B23K 2203/56 (2015.10); H01L 23/5258 (2013.01);
Abstract

A method for irradiating semiconductor material is provided which includes selecting a region of a semiconductor layer surface, irradiating the region with an excimer laser which has a beam spot size, and adjusting the beam spot size to match the selected region size. Further, an apparatus for irradiating semiconductor material is provided. The apparatus includes an excimer laser for irradiating a selected region of a semiconductor layer surface, the laser has a laser beam spot size, and a system for adjusting the laser beam spot size to match the selected region size.


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