The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 11, 2017

Filed:

Dec. 18, 2014
Applicant:

Hakko Corporation, Osaka, JP;

Inventors:

Kenji Matsuzaki, Osaka, JP;

Hitoshi Takeuchi, Osaka, JP;

Toshizaki Mochizuki, Osaka, JP;

Assignee:

HAKKO CORPORATION, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 37/00 (2006.01); B23K 3/02 (2006.01); B23K 3/03 (2006.01); G01K 7/02 (2006.01); H05B 3/00 (2006.01); B23K 3/08 (2006.01);
U.S. Cl.
CPC ...
B23K 3/026 (2013.01); B23K 3/02 (2013.01); B23K 3/03 (2013.01); B23K 3/08 (2013.01); G01K 7/02 (2013.01); H05B 3/00 (2013.01);
Abstract

The invention is directed to designs for heater-sensor sub-assemblies for soldering cartridges and de-soldering cartridges for soldering systems. The designs provide a high thermal capacity and accurate tip temperature sensing and control features. The coil portion of the heater assembly is spaced proximally from the distal end of the subassembly to segregate the coil from the thermocouple temperature sensor. The solder cartridges include connector wires of dissimilar sizes and materials to couple the heater coil wire to the connections of a handle and the soldering station to reduce heat conduction to the handle.


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