The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 04, 2017

Filed:

Feb. 11, 2016
Applicant:

Yazaki Corporation, Tokyo, JP;

Inventors:

Akemi Maebashi, Shizuoka, JP;

Pharima Akanitsuk, Shizuoka, JP;

Assignee:

YAZAKI CORPORATION, Minato-ku, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/14 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H05K 3/3447 (2013.01); H05K 2201/09818 (2013.01); H05K 2201/09827 (2013.01); H05K 2201/09836 (2013.01); H05K 2201/09845 (2013.01); H05K 2201/10272 (2013.01);
Abstract

An electronic component unit and a wire harness are provided with a bus bar plate. The bus bar plate is provided with a metallic bus bar that is built in a resin material, and including a through-hole in which a terminal of a relay mounted on a mounting surface is soldered. The through-hole is provided with a bus bar through-hole which penetrates the bus bar, and a resin material through-hole which penetrates the resin material and is formed to be larger than the bus bar through-hole to expose the surface of the bus bar. When an inner diameter of the bus bar through-hole is defined as r and an inner diameter of the resin material through-hole is defined as R, 1.5r≦R is satisfied.


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