The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 04, 2017
Filed:
May. 31, 2014
Applicant:
Cytec Industries Inc., Woodland Park, NJ (US);
Inventors:
Richard David Jordan, Jr., Allegany, NY (US);
Thomas C. Scanlon, IV, Hinsdale, NY (US);
Assignee:
Cytec Industries Inc., , NJ (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C08G 18/24 (2006.01); C08G 18/48 (2006.01); C08G 18/76 (2006.01); C09D 175/04 (2006.01); H05K 3/28 (2006.01);
U.S. Cl.
CPC ...
H05K 3/284 (2013.01); C08G 18/246 (2013.01); C08G 18/4825 (2013.01); C08G 18/7664 (2013.01); C09D 175/04 (2013.01); H05K 3/285 (2013.01); H05K 2201/09872 (2013.01);
Abstract
Formulated resin systems containing polymeric flood coat compositions are provided herein and characterized by having an initial mix thixotropic index from 1 to 5, and a gel time from 5 to 15 minutes such that when cured the compositions provide a Shore hardness from 15 A to 90 A, a thickness on horizontal surfaces from 20 mils to 75 mils, and a thickness on vertical surfaces from 4 mils to 20 mils. Electronic circuit assemblies flood coated with such formulated resin systems, and methods for protecting and supporting said assemblies, are also provided.