The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 04, 2017

Filed:

May. 08, 2015
Applicant:

Ngk Spark Plug Co., Ltd., Nagoya-shi, Aichi-ken, JP;

Inventor:

Takahiro Hayashi, Chino, JP;

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 1/09 (2006.01); H05K 3/28 (2006.01); H05K 1/02 (2006.01); H05K 3/46 (2006.01); H05K 3/18 (2006.01); H05K 3/24 (2006.01); H05K 3/38 (2006.01); H05K 3/40 (2006.01);
U.S. Cl.
CPC ...
H05K 3/28 (2013.01); H05K 1/0284 (2013.01); H05K 3/46 (2013.01); H05K 3/188 (2013.01); H05K 3/243 (2013.01); H05K 3/244 (2013.01); H05K 3/282 (2013.01); H05K 3/381 (2013.01); H05K 3/383 (2013.01); H05K 3/4007 (2013.01); H05K 3/4602 (2013.01); H05K 3/4661 (2013.01); H05K 2201/0959 (2013.01); H05K 2201/09409 (2013.01); H05K 2201/09536 (2013.01); H05K 2201/10204 (2013.01); H05K 2203/0307 (2013.01); H05K 2203/058 (2013.01); H05K 2203/0574 (2013.01); H05K 2203/0597 (2013.01); H05K 2203/0766 (2013.01); Y10T 29/49156 (2015.01);
Abstract

A method of manufacturing a wiring substrate according to the present invention includes a step of forming a wiring layer including connection terminals on a first insulating layer; a step of forming a second insulating layer on the wiring layer and on the first insulating layer; a step of forming electrically insulative dummy portions separated from the wiring layer on the first insulating layer through patterning of the second insulating layer; a step of forming a third insulating layer on the wiring layer, on the dummy portions, and on the first insulating layer; and a step of forming openings in the third insulating layer for exposing the connection terminals in such a manner that upper end portions of the connection terminals protrude from the third insulating layer, and lower end portions of the connection terminals are embedded in the third insulating layer.


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