The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 04, 2017
Filed:
Feb. 20, 2015
Murata Manufacturing Co., Ltd., Kyoto, JP;
Takahiro Baba, Kyoto, JP;
Yuki Wakabayashi, Kyoto, JP;
MURATA MANUFACTURING CO., LTD., Kyoto, JP;
Abstract
A component-embedded board includes a multilayer board obtained by stacking resin layers and an electronic component in the multilayer board having terminal electrodes on at least one principal face. The resin layers include a first resin layer having a space to accommodate the electronic component and at least one first interlayer connector formed by solidifying a conductive paste outside each of at least three sides of a principal face of the electronic component and a second resin layer having second and third interlayer connectors formed by solidifying a conductive paste. At least one second interlayer connector is positioned outside the three sides of the principal face. The third interlayer connectors are joined to the terminal electrodes. The first resin layer and the second resin layer are adjacent to each other in a stacking direction within the multilayer board. The first interlayer connector and the second interlayer connector are joined.