The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 04, 2017
Filed:
Jul. 30, 2015
Applicant:
SK Hynix Inc., Icheon-si, Gyeonggi-do, KR;
Inventor:
Jung Tae Jeong, Icheon-si, KR;
Assignee:
SK hynix Inc., Icheon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/10 (2006.01); H05K 9/00 (2006.01); H05K 1/18 (2006.01); H05K 3/34 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H05K 1/181 (2013.01); H01L 23/49811 (2013.01); H05K 3/3436 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2924/15174 (2013.01); H01L 2924/181 (2013.01); H05K 2201/10287 (2013.01); H05K 2201/10719 (2013.01); H05K 2201/10727 (2013.01); H05K 2203/049 (2013.01);
Abstract
A semiconductor package module may include a first substrate, and a second substrate disposed to face the first substrate. The semiconductor package module may include an interconnection member electrically connecting the first substrate to the second substrate and including a plurality of wires. Portions of the plurality of wires may be twisted and wound together and may be bent to extend in a predetermined direction.