The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 04, 2017
Filed:
Aug. 28, 2015
Applicant:
Fujitsu Limited, Kawasaki-shi, Kanagawa, JP;
Inventor:
Taiga Fukumori, Isehara, JP;
Assignee:
FUJITSU LIMITED, Kawasaki, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 1/14 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0243 (2013.01); H05K 1/0218 (2013.01); H05K 1/0251 (2013.01); H05K 2201/09618 (2013.01); H05K 2201/09672 (2013.01); H05K 2201/10674 (2013.01);
Abstract
A circuit substrate includes: a plurality of signal wirings formed at different positions of the circuit substrate in a thickness direction and extending in parallel in the circuit substrate; and ground layers or power supply layers formed at both sides of the circuit substrate in the thickness direction by interposing the plurality of the signal wirings between the ground layers or between the power supply layers, wherein the plurality of signal wirings are electrically coupled with each other by a plurality of conductors formed at an interval narrower than an interval by which a resonance is caused.