The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 04, 2017

Filed:

May. 28, 2015
Applicant:

Lutron Electronics Co., Inc., Coopersburg, PA (US);

Inventors:

Richard S. Camden, Coopersburg, PA (US);

Donald R. Mosebrook, Coopersburg, PA (US);

William Taylor Shivell, Breinigsville, PA (US);

Amy E. Miller, Allentown, PA (US);

Assignee:

LUTRON ELECTRONICS CO., INC., Coopersburg, PA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/24 (2006.01); H05B 37/02 (2006.01); H04L 12/28 (2006.01); H01Q 1/22 (2006.01); H01Q 1/12 (2006.01); G05B 15/02 (2006.01); H04W 4/00 (2009.01); H01Q 13/10 (2006.01); G08C 17/02 (2006.01);
U.S. Cl.
CPC ...
H05B 37/02 (2013.01); G05B 15/02 (2013.01); G08C 17/02 (2013.01); H01Q 1/1221 (2013.01); H01Q 1/22 (2013.01); H01Q 1/24 (2013.01); H01Q 13/10 (2013.01); H04L 12/2816 (2013.01); H04W 4/008 (2013.01); G08C 2201/30 (2013.01);
Abstract

A wall-mountable wireless control device may comprise a yoke, a faceplate assembly, an antenna, a radio-frequency communication circuit, and/or a control circuit. The radio-frequency communication circuit may be configured to transmit or receive radio-frequency signals via the antenna. The faceplate assembly may comprise a conductive element that is configured to operate as a radiating element of the antenna when the faceplate assembly is attached to the yoke. The conductive element may comprise a conductive material on the front surface of the faceplate. The conductive element may be attached to a rear surface of the faceplate (e.g., as a conductive backer). The conductive element may be located inside of the faceplate. The conductive element may comprise metallization applied to a plastic carrier of the faceplate. The faceplate assembly may comprise an adapter plate comprising a surface on which the conductive element is located.


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