The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 04, 2017

Filed:

May. 24, 2012
Applicants:

Wen LI, Tokyo, JP;

Norio Chujo, Tokyo, JP;

Masami Makuuchi, Tokyo, JP;

Takehito Kamimura, Tokyo, JP;

Inventors:

Wen Li, Tokyo, JP;

Norio Chujo, Tokyo, JP;

Masami Makuuchi, Tokyo, JP;

Takehito Kamimura, Tokyo, JP;

Assignee:

Hitachi, Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H03K 19/0175 (2006.01); H03F 1/52 (2006.01); H03F 3/195 (2006.01); H03F 3/21 (2006.01); H03F 3/30 (2006.01);
U.S. Cl.
CPC ...
H03K 19/0175 (2013.01); H03F 1/52 (2013.01); H03F 3/195 (2013.01); H03F 3/211 (2013.01); H03F 3/3022 (2013.01); H03K 19/017509 (2013.01); H01L 2224/48137 (2013.01); H01L 2924/181 (2013.01); H03F 2200/189 (2013.01);
Abstract

Provided is a configuration of a driver integrated circuit that can output a voltage exceeding the withstand voltage of a process, and that satisfies required apparatus performance (high speed and high voltage). A differential input circuit, a level shift circuit, and an output circuit are manufactured by the same process and divided and disposed on three or more chips with different substrate potentials (sub-potentials). By setting different applied voltages to the substrates of the chips, an output voltage greater than the process withstand voltage can be provided (see FIG.).


Find Patent Forward Citations

Loading…