The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 04, 2017

Filed:

May. 30, 2016
Applicant:

Delta Electronics, Inc., Taoyuan, TW;

Inventors:

Zeng Li, Taoyuan, TW;

Jun-Cheng Lu, Taoyuan, TW;

Tao Wang, Taoyuan, TW;

Zheng-Fen Wan, Taoyuan, TW;

Zhen-Qing Zhao, Taoyuan, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 21/50 (2006.01); H02M 7/00 (2006.01); H01L 23/498 (2006.01); H01L 25/18 (2006.01); H01L 25/07 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H02M 7/003 (2013.01); H01L 21/4846 (2013.01); H01L 23/49833 (2013.01); H01L 23/49838 (2013.01); H01L 25/072 (2013.01); H01L 25/18 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 24/83 (2013.01); H01L 24/85 (2013.01); H01L 24/92 (2013.01); H01L 2224/2732 (2013.01); H01L 2224/291 (2013.01); H01L 2224/293 (2013.01); H01L 2224/29294 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32227 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48157 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83815 (2013.01); H01L 2224/92247 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/1203 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19043 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/19107 (2013.01);
Abstract

A power module packaging structure includes a first conducting layer, a first insulating layer, a second conducting layer, a first power device, and a first controlling device. The first insulating layer is disposed above the first conducting layer. The second conducting layer is disposed above the first insulating layer. The first power device is disposed on the first conducting layer. The first controlling device is disposed on the second conducting layer and used for controlling the first power device. The first conducting layer, the second conducting layer, the first power device, and the first controlling device form a loop. A direction of a current which flows through the first conducting layer in the loop is opposite to a direction of a current which flows through the second conducting layer in the loop.


Find Patent Forward Citations

Li, Zeng. (2017). Power module packaging structure and method for manufacturing the same (U.S. Patent No. 9698701). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9698701

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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