The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 04, 2017

Filed:

Oct. 27, 2011
Applicants:

Ravi Palaniswamy, Singapore, SG;

Arokiaraj Jesudoss, Singapore, SG;

Alejandro Aldrin IL Agcaoili Narag, Singapore, SG;

James R. White, Singapore, SG;

Fong Liang Tan, Singapore, SG;

Andrew J. Ouderkirk, St. Paul, MN (US);

Justine A. Mooney, Austin, TX (US);

Nathan P. Kreutter, Austin, TX (US);

Qihong Nie, Woodbury, MN (US);

Jian Xia Gao, Singapore, SG;

Inventors:

Ravi Palaniswamy, Singapore, SG;

Arokiaraj Jesudoss, Singapore, SG;

Alejandro Aldrin Il Agcaoili Narag, Singapore, SG;

James R. White, Singapore, SG;

Fong Liang Tan, Singapore, SG;

Andrew J. Ouderkirk, St. Paul, MN (US);

Justine A. Mooney, Austin, TX (US);

Nathan P. Kreutter, Austin, TX (US);

Qihong Nie, Woodbury, MN (US);

Jian Xia Gao, Singapore, SG;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/22 (2006.01); H01S 5/024 (2006.01); H01L 33/64 (2010.01); H01L 33/48 (2010.01); H05K 1/18 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01S 5/024 (2013.01); H01L 24/32 (2013.01); H01L 33/486 (2013.01); H01L 33/64 (2013.01); H01L 33/647 (2013.01); H05K 1/183 (2013.01); H05K 1/189 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/01327 (2013.01); H01L 2924/07802 (2013.01); H01L 2924/12032 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/15747 (2013.01); H01L 2924/15787 (2013.01); H01L 2924/181 (2013.01); H01L 2924/3011 (2013.01); H01L 2924/351 (2013.01); H05K 2201/10106 (2013.01);
Abstract

Provided is a flexible light emitting semiconductor device, such as an LED device, that includes a flexible dielectric layer having first and second major surfaces with a conductive layer on the first major surface and at least one cavity in the first major surface with a conductive layer in the cavity that supports a light emitting semiconductor device. The conductive layer in the cavity is electrically isolated from the second major surface of the dielectric layer.


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