The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 04, 2017

Filed:

Mar. 18, 2014
Applicant:

Sony Corporation, Tokyo, JP;

Inventors:

Kazuaki Toba, Kanagawa, JP;

Akira Matsuda, Tokyo, JP;

Taichi Hirano, Kanagawa, JP;

Assignee:

Sony Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R 13/6587 (2011.01); H01R 13/6581 (2011.01); H01R 24/66 (2011.01); H01R 13/6594 (2011.01); H05K 5/02 (2006.01); H01R 24/60 (2011.01);
U.S. Cl.
CPC ...
H01R 13/6587 (2013.01); H01R 13/6581 (2013.01); H01R 13/6594 (2013.01); H01R 24/66 (2013.01); H01R 24/60 (2013.01); H05K 5/0269 (2013.01);
Abstract

To be able to further reduce deterioration in signal quality, there is provided a connector including: a signal pin () that is connected to a wiring pattern () on a mounted substrate () and that transmits a signal to an inside and an outside of any apparatus, the mounted substrate () having an end disposed in the apparatus; and a shell () that is formed of an electric conductor and grounded to ground potential on the mounted substrate (), in a manner that the shell () covers the signal pin () in a region in which the signal pin () stretches toward the mounted substrate ().


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