The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 04, 2017

Filed:

Jan. 23, 2014
Applicants:

Rohde & Schwarz Gmbh & Co. KG, Munich, DE;

Rpg Radiometer Physics Gmbh, Meckenheim, DE;

Inventors:

Christian Pinta, Munich, DE;

Mathias Nagel, Munich, DE;

Gerd Hechtfischer, Vaterstetten, DE;

Achim Walber, Rheinbach, DE;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01P 3/12 (2006.01); H05K 1/02 (2006.01); H01P 3/08 (2006.01); H01P 11/00 (2006.01); H05K 3/00 (2006.01); H01P 1/207 (2006.01);
U.S. Cl.
CPC ...
H01P 3/12 (2013.01); H01P 3/087 (2013.01); H01P 11/002 (2013.01); H05K 1/02 (2013.01); H05K 3/007 (2013.01); H01P 1/207 (2013.01); H05K 2201/09781 (2013.01); H05K 2201/2009 (2013.01); Y10T 29/49158 (2015.01);
Abstract

A substrate-based circuit () provides a carrier substrate (), wherein a bond layer () is embodied on at least one part of the carrier substrate (), and wherein a contact layer () which forms at least one conductor line () and/or at least one antenna element () is embodied on at least one first part () of the bond layer (). The carrier substrate () provides at least one fastening element (), which is deposited at the outer region of the carrier substrate () and projects beyond the outer region of the carrier substrate ().


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