The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 04, 2017
Filed:
Mar. 31, 2014
Applicant:
Johnson Controls Technology Company, Holland, MI (US);
Inventors:
Edward J. Soleski, Mequon, WI (US);
Richard M. DeKeuster, Racine, WI (US);
Bryan L. Thieme, Colgate, WI (US);
Ronald J. Dulle, Mequon, WI (US);
Mikhail S. Balk, Brown Deer, WI (US);
Assignee:
Johnson Controls Technology Company, Holland, MI (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 9/00 (2006.01); H01M 2/22 (2006.01); B60R 16/03 (2006.01); H02J 7/00 (2006.01); G01R 31/36 (2006.01); H01M 10/04 (2006.01); H01M 10/42 (2006.01); H01M 10/058 (2010.01); H01M 2/12 (2006.01); H01M 2/10 (2006.01); H01M 2/24 (2006.01); H01M 2/20 (2006.01); H01M 2/34 (2006.01); H01H 47/32 (2006.01); H01M 10/48 (2006.01); H05K 1/18 (2006.01); H05K 3/32 (2006.01); B60L 11/18 (2006.01); H01M 2/30 (2006.01); H01M 10/6551 (2014.01); B60L 1/00 (2006.01); B60L 1/02 (2006.01); B60L 1/14 (2006.01); B60L 3/00 (2006.01); B60L 3/12 (2006.01); B60L 11/12 (2006.01); B60L 11/14 (2006.01); B60L 15/20 (2006.01); B60R 16/033 (2006.01); H01R 12/71 (2011.01); H05K 1/02 (2006.01); H02H 7/18 (2006.01); G01R 31/02 (2006.01); H01M 2/32 (2006.01); H01M 4/66 (2006.01);
U.S. Cl.
CPC ...
H01M 2/22 (2013.01); B60L 1/003 (2013.01); B60L 1/02 (2013.01); B60L 1/14 (2013.01); B60L 3/0046 (2013.01); B60L 3/12 (2013.01); B60L 11/123 (2013.01); B60L 11/14 (2013.01); B60L 11/1803 (2013.01); B60L 11/1851 (2013.01); B60L 11/1861 (2013.01); B60L 11/1864 (2013.01); B60L 11/1874 (2013.01); B60L 11/1877 (2013.01); B60L 11/1879 (2013.01); B60L 15/20 (2013.01); B60R 16/03 (2013.01); B60R 16/033 (2013.01); G01R 31/362 (2013.01); H01H 47/325 (2013.01); H01M 2/1077 (2013.01); H01M 2/1205 (2013.01); H01M 2/1211 (2013.01); H01M 2/1252 (2013.01); H01M 2/20 (2013.01); H01M 2/206 (2013.01); H01M 2/24 (2013.01); H01M 2/305 (2013.01); H01M 2/34 (2013.01); H01M 10/04 (2013.01); H01M 10/0413 (2013.01); H01M 10/058 (2013.01); H01M 10/425 (2013.01); H01M 10/4257 (2013.01); H01M 10/482 (2013.01); H01M 10/486 (2013.01); H01M 10/6551 (2015.04); H02J 7/0021 (2013.01); H02J 7/0063 (2013.01); H05K 1/18 (2013.01); H05K 3/32 (2013.01); B60L 2210/10 (2013.01); B60L 2210/40 (2013.01); B60L 2240/34 (2013.01); B60L 2240/545 (2013.01); B60L 2240/547 (2013.01); B60L 2240/549 (2013.01); B60L 2250/10 (2013.01); B60L 2260/26 (2013.01); B60L 2270/20 (2013.01); G01R 31/025 (2013.01); G01R 31/3627 (2013.01); H01M 2/32 (2013.01); H01M 2/342 (2013.01); H01M 4/661 (2013.01); H01M 4/665 (2013.01); H01M 2010/4271 (2013.01); H01M 2200/103 (2013.01); H01M 2220/20 (2013.01); H01M 2250/20 (2013.01); H01R 12/716 (2013.01); H02H 7/18 (2013.01); H05K 1/0262 (2013.01); H05K 1/0263 (2013.01); H05K 2201/1053 (2013.01); H05K 2201/10492 (2013.01); H05K 2201/10545 (2013.01); Y02T 10/6217 (2013.01); Y02T 10/645 (2013.01); Y02T 10/705 (2013.01); Y02T 10/7005 (2013.01); Y02T 10/7016 (2013.01); Y02T 10/7044 (2013.01); Y02T 10/7061 (2013.01); Y02T 10/7077 (2013.01); Y02T 10/7216 (2013.01); Y02T 10/7241 (2013.01); Y02T 10/7275 (2013.01); Y10T 29/4911 (2015.01); Y10T 29/49108 (2015.01); Y10T 29/49114 (2015.01);
Abstract
A printed circuit board (PCB) assembly includes a PCB and a high current interconnect mounted on the PCB. The high current interconnect is configured to electrically couple a first high current bladed component, a second high current bladed component, and a trace disposed on the PCB. The high current interconnect includes feet made of a conductive material that are coupled to the PCB. The trace is coupled to the feet via a weld.
Soleski, Edward. (2017). High current interconnect system and method for use in a battery module (U.S. Patent No. 9698403). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9698403
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile