The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 04, 2017

Filed:

Jun. 06, 2013
Applicant:

Shikoku Instrumentation Co., Ltd., Nakatado-gun, Kagawa, JP;

Inventors:

Masamichi Ishihara, Kitakyushu, JP;

Kenshu Oyama, Ogori, JP;

Shoji Murakami, Nakatado-gun, JP;

Hitonobu Onosaka, Nakatado-gun, JP;

Masato Shima, Nakatado-gun, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 33/60 (2010.01); H01L 33/62 (2010.01); H01L 25/075 (2006.01); F21V 29/70 (2015.01); F21V 7/00 (2006.01); F21V 23/02 (2006.01); H01L 27/15 (2006.01); H01L 33/64 (2010.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); F21V 7/0066 (2013.01); F21V 23/023 (2013.01); F21V 29/70 (2015.01); H01L 25/0753 (2013.01); H01L 27/156 (2013.01); H01L 33/60 (2013.01); H01L 33/641 (2013.01); H01L 33/642 (2013.01); H01L 33/644 (2013.01); H01L 2224/45139 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2924/181 (2013.01); H05K 1/0274 (2013.01); H05K 2201/10106 (2013.01); H05K 2201/2054 (2013.01);
Abstract

An LED illumination module in which LED bare chips are mounted on a mounting substrate at a high density, the module comprising many LED bare chips having the same specifications, the mounting substrate at least a surface of which is metal, and a reflection region in which the LED bare chips are sealed off with resin, wherein a surface of the reflection region of the mounting substrate is covered with an inorganic white insulating layer that functions as a reflection member, a unit LED chip group including a plurality of LED bare chips connected in series is disposed plural, the plural unit LED chip groups being connected in parallel, overall light flux is 10,000 lumens or more, and a mounting area density of the LED bare chips in the reflection region is 15 mm/cmor more. An LED illumination apparatus including the LED illumination module is also provided.


Find Patent Forward Citations

Loading…