The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 04, 2017

Filed:

Sep. 04, 2014
Applicant:

Nichia Corporation, Anan-shi, JP;

Inventors:

Akinori Yoneda, Anan, JP;

Yoshiyuki Aihara, Tokushima, JP;

Shinji Nakamura, Tokushima, JP;

Akiyoshi Kinouchi, Komatsushima, JP;

Kazuki Kashimoto, Tokushima, JP;

Kazuyuki Akaishi, Tokushima, JP;

Assignee:

NICHIA CORPORATION, Anan-Shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 33/38 (2010.01); H01L 33/54 (2010.01); H01L 33/62 (2010.01); H01L 33/48 (2010.01); H01L 33/40 (2010.01);
U.S. Cl.
CPC ...
H01L 33/385 (2013.01); H01L 33/486 (2013.01); H01L 33/54 (2013.01); H01L 33/62 (2013.01); H01L 33/387 (2013.01); H01L 33/405 (2013.01);
Abstract

A side-view type light emitting device having a bottom surface thereof as a light emission surface and one side surface thereof as amounting surface for mounting on amounting substrate includes a stacked semiconductor layer having a first semiconductor layer, an active layer, and a second semiconductor layer which are stacked in that order from a side of the bottom surface; a first connecting electrode exposed from the one side surface and electrically connected to the first semiconductor layer; a metal wire having one end thereof electrically connected to an upper surface of the second semiconductor layer; a second connecting electrode exposed from the one side surface and electrically connected to the other end of the metal wire; and a resin layer which covers at least a part of each of the first semiconductor layer, the second semiconductor layer, the first connecting electrode, the second connecting electrode and the metal wire and which is configured to form an upper surface and side surfaces of the light emitting device.


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