The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 04, 2017

Filed:

Jun. 08, 2016
Applicant:

Enraytek Optoelectronics Co., Ltd., Shanghai, CN;

Inventors:

Huiwen Xu, Shanghai, CN;

Yu Zhang, Shanghai, CN;

Qiming Li, Shanghai, CN;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 27/15 (2006.01); H01L 33/32 (2010.01); H01L 33/00 (2010.01);
U.S. Cl.
CPC ...
H01L 27/153 (2013.01); H01L 33/007 (2013.01); H01L 33/32 (2013.01);
Abstract

A high-voltage flip LED chip and a manufacturing method thereof. In the high-voltage flip LED chip, a P-N electrode connecting metal block is filled into an isolation trench between two adjacent chip units and is respectively filled into a first electrode hole of one chip unit and a second electrode hole of the other chip unit to serially connect the two adjacent chips. Since the chip units are interconnected by adopting large-area metal and the metal is filled into the isolation trench, not only can the high luminous efficiency of the chip be guaranteed, but also the high reliability and excellent current spreading between the units are guaranteed, the process stability can be improved, and the rate of non-defective products and the product reliability are improved; since the isolation trenches between the chip units adopt an ODR design, the reflectivity of reflectors at the trenches can be improved and the absorption by electrodes is reduced; and since the chip has large-area spacing-controllable P and N electrodes, the heat dissipating capability of the chip is guaranteed to be good and simultaneously the packaging difficulty is reduced.


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