The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 04, 2017

Filed:

Mar. 29, 2016
Applicant:

AU Optronics Corp., Hsin-Chu, TW;

Inventors:

Shin-Shueh Chen, Hsin-Chu, TW;

Pei-Ming Chen, Hsin-Chu, TW;

Assignee:

AU OPTRONICS CORP., Hsin-Chu, TW;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 27/144 (2006.01); H01L 29/423 (2006.01); H01L 29/417 (2006.01); H01L 29/66 (2006.01); H01L 31/18 (2006.01); H01L 31/02 (2006.01);
U.S. Cl.
CPC ...
H01L 27/1443 (2013.01); H01L 29/41733 (2013.01); H01L 29/42356 (2013.01); H01L 29/66765 (2013.01); H01L 29/66969 (2013.01); H01L 31/02005 (2013.01); H01L 31/1804 (2013.01); H01L 31/1864 (2013.01); H01L 31/1884 (2013.01);
Abstract

An integration method of fabricating optical sensor device and thin film transistor device includes the follow steps. A substrate is provided, and a gate electrode and a bottom electrode are formed on the substrate. A first insulating layer is formed on the gate electrode and the bottom electrode, and the first insulating layer at least partially exposes the bottom electrode. An optical sensing pattern is formed on the bottom electrode. A patterned transparent semiconductor layer is formed on the first insulating layer, wherein the patterned transparent semiconductor layer includes a first transparent semiconductor pattern covering the gate electrode, and a second transparent semiconductor pattern covering the optical sensing pattern. A source electrode and a drain electrode are formed on the first transparent semiconductor pattern. A modification process including introducing at least one gas is performed on the second transparent semiconductor pattern to transfer the second transparent semiconductor pattern into a conductive transparent top electrode.


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