The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 04, 2017

Filed:

May. 10, 2016
Applicant:

AU Optronics Corporation, Hsin-Chu, TW;

Inventors:

Tsung-Tien Wu, Hsin-Chu, TW;

Kang-Hung Liu, Hsin-Chu, TW;

Tsung-Yi Lin, Hsin-Chu, TW;

Assignee:

AU OPTRONICS CORPORATION, Hsin-Chu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/16 (2006.01); H01L 27/12 (2006.01); H01L 21/683 (2006.01); H01L 33/00 (2010.01); H01L 25/075 (2006.01);
U.S. Cl.
CPC ...
H01L 27/1214 (2013.01); H01L 21/6835 (2013.01); H01L 33/0095 (2013.01); H01L 25/0753 (2013.01); H01L 2221/68322 (2013.01); H01L 2221/68354 (2013.01); H01L 2221/68368 (2013.01); H01L 2221/68381 (2013.01);
Abstract

A method for transferring micro devices is provided. The method includes the following operations: providing a carrier substrate and forming micro devices on the carrier substrate; forming a fixing layer on the carrier substrate, in which the fixing layer is at least in contact with bottom parts of the micro devices; patterning the fixing layer to selectively expose a portion of the micro devices; providing a transfer device correspondingly located on the carrier substrate, and picking up the exposed micro devices by the transfer device; and providing a receiving substrate and transferring the exposed micro devices to the receiving substrate.


Find Patent Forward Citations

Loading…