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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9698133 B1

PDFFull Text
Date of Patent:
Jul. 04, 2017

Filed:

Jul. 31, 2015

Method of manufacturing a multichip package structure

Applicant:

Paragon Semiconductor Lighting Technology Co., Ltd., New Taipei, TW;

Inventors:

Chia-Tin Chung, Miaoli County, TW;

Fang-Kuei Wu, Taoyuan County, TW;

Assignee:

PARAGON SEMICONDUCTOR LIGHTING TECHNOLOGY CO., LTD, New Taipei, TW;

Attorneys:

Pai Patent & Trademark Law Firm

Chao-Chang David Pai

Primary Examiner:

Jerome Jackson, Jr

Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 25/00 (2006.01); H01L 25/075 (2006.01); H01L 33/60 (2010.01); F21V 31/04 (2006.01); H01L 23/24 (2006.01); F21K 9/68 (2016.01); H01L 33/54 (2010.01); H05K 1/02 (2006.01); H05K 3/28 (2006.01); F21Y 105/10 (2016.01); F21Y 115/10 (2016.01);
U.S. Cl.
CPC ...
H01L 25/50 (2013.01); F21K 9/68 (2016.08); F21V 31/04 (2013.01); H01L 23/24 (2013.01); H01L 25/0753 (2013.01); H01L 33/60 (2013.01); F21Y 2105/10 (2016.08); F21Y 2115/10 (2016.08); H01L 33/54 (2013.01); H01L 2224/05553 (2013.01); H01L 2224/48091 (2013.01); H01L 2924/181 (2013.01); H01L 2933/0033 (2013.01); H01L 2933/0058 (2013.01); H05K 1/0203 (2013.01); H05K 3/284 (2013.01); H05K 2201/10106 (2013.01); H05K 2201/2054 (2013.01);
Abstract

A method of manufacturing a multichip package structure includes providing a substrate body; placing a plurality of light-emitting chips on the substrate body, the light-emitting chips being electrically connected to the substrate body; surroundingly forming surrounding liquid colloid on the substrate body to surround the light-emitting chips; naturally drying an outer layer of the surrounding liquid colloid at a predetermined room temperature to form a semidrying surrounding light-reflecting frame, the semidrying surrounding light-reflecting frame having a non-drying surrounding colloid body disposed on the substrate body and a dried surrounding colloid body totally covering the non-drying surrounding colloid body; and then forming a package colloid body on the substrate body to cover the light-emitting chips, the semidrying surrounding light-reflecting frame contacting and surrounding the package colloid body.

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