The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 04, 2017
Filed:
Aug. 17, 2016
Applicant:
Motorola Mobility Llc, Chicago, IL (US);
Inventors:
Assignee:
Motorola Mobility LLC, Chicago, IL (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01); H01L 25/18 (2006.01); H01L 25/065 (2006.01); H01L 23/373 (2006.01); H01L 23/367 (2006.01); H01L 23/427 (2006.01); H01L 23/552 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/18 (2013.01); H01L 23/3675 (2013.01); H01L 23/373 (2013.01); H01L 23/3736 (2013.01); H01L 23/3737 (2013.01); H01L 23/427 (2013.01); H01L 23/552 (2013.01); H01L 24/17 (2013.01); H01L 25/0657 (2013.01); H01L 2224/16225 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06572 (2013.01); H01L 2225/06589 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/1434 (2013.01); H01L 2924/3025 (2013.01);
Abstract
A chip package stack up includes a processor chip package that has a top surface and a bottom surface, an interposer, disposed above and connected to the processor chip package top surface; a memory chip package disposed above the interposer and connected to the processor chip package through the interposer; and a processor chip package heat spreader having a bottom surface adhered to the processor chip package top surface, and having an extending portion that extends outwardly from an edge of the processor chip package.