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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9698132 B1

PDFFull Text
Date of Patent:
Jul. 04, 2017

Filed:

Aug. 17, 2016

Chip package stack up for heat dissipation

Applicant:

Motorola Mobility Llc, Chicago, IL (US);

Inventors:

Roger Ady, Chicago, IL (US);

Morris Bowers, Grayslake, IL (US);

Paul Crosbie, Grayslake, IL (US);

Assignee:

Motorola Mobility LLC, Chicago, IL (US);

Attorneys:

Cygan Law Offices P.C.

Joseph T. Cygan

Primary Examiner:

Trung Q Dang

Int. Cl.
CPC ...
H01L 23/34 (2006.01); H01L 25/18 (2006.01); H01L 25/065 (2006.01); H01L 23/373 (2006.01); H01L 23/367 (2006.01); H01L 23/427 (2006.01); H01L 23/552 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/18 (2013.01); H01L 23/3675 (2013.01); H01L 23/373 (2013.01); H01L 23/3736 (2013.01); H01L 23/3737 (2013.01); H01L 23/427 (2013.01); H01L 23/552 (2013.01); H01L 24/17 (2013.01); H01L 25/0657 (2013.01); H01L 2224/16225 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06572 (2013.01); H01L 2225/06589 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/1434 (2013.01); H01L 2924/3025 (2013.01);
Abstract

A chip package stack up includes a processor chip package that has a top surface and a bottom surface, an interposer, disposed above and connected to the processor chip package top surface; a memory chip package disposed above the interposer and connected to the processor chip package through the interposer; and a processor chip package heat spreader having a bottom surface adhered to the processor chip package top surface, and having an extending portion that extends outwardly from an edge of the processor chip package.

Find Patent Forward Citations

Ady, Roger. (2017). Chip package stack up for heat dissipation (U.S. Patent No. 9698132). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9698132

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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