The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 04, 2017
Filed:
Jan. 20, 2015
Applicant:
Samsung Electronics Co., Ltd., Suwon-Si, Gyeonggi-Do, KR;
Inventors:
Yongdae Ha, Asan-si, KR;
Jaeryoung Lee, Asan-si, KR;
Chulmin Kim, Cheonan-si, KR;
Yisung Hwang, Asan-si, KR;
Teaseog Um, Asan-si, KR;
Yongjin Jung, Asan-si, KR;
Assignee:
Samsung Electronics Co., Ltd., Gyeonggi-Do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/683 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 24/75 (2013.01); H01L 21/67144 (2013.01); H01L 21/6838 (2013.01); H01L 2221/68363 (2013.01); H01L 2224/7555 (2013.01); H01L 2224/7565 (2013.01); Y10T 156/1132 (2015.01); Y10T 156/1179 (2015.01); Y10T 156/1944 (2015.01); Y10T 156/1983 (2015.01);
Abstract
The die bonding apparatus including a transferring unit, a loading member loading a substrate to the transferring unit, an unloading member unloading the substrate from the transferring unit, a wafer holder supporting a wafer providing dies, and a bonding member picking up one of the dies from the wafer and bonding the picked-up die to the substrate loaded on the transferring unit by pressuring the picked-up die against the substrate using a gas may be provided.