The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 04, 2017
Filed:
Mar. 17, 2016
Applicant:
Infineon Technologies Austria Ag, Villach, AT;
Inventors:
Kae-Horng Wang, Villach, AT;
Francisco Javier Santos Rodriguez, Villach, AT;
Michael Knabl, Sattendorf, AT;
Guenther Koffler, Ledenitzen, AT;
Assignee:
Infineon Technologies Austria AG, Villach, AT;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); H01L 23/00 (2006.01); H01L 21/02 (2006.01); C23C 16/34 (2006.01); C23C 16/40 (2006.01); C23C 16/50 (2006.01); C23C 18/16 (2006.01); G03F 7/16 (2006.01); G03F 7/20 (2006.01); G03F 7/26 (2006.01); H01J 37/32 (2006.01); H01L 21/311 (2006.01); H01L 21/288 (2006.01); H01L 23/485 (2006.01); H01L 27/146 (2006.01);
U.S. Cl.
CPC ...
H01L 23/564 (2013.01); C23C 16/34 (2013.01); C23C 16/40 (2013.01); C23C 16/50 (2013.01); C23C 18/1619 (2013.01); G03F 7/16 (2013.01); G03F 7/20 (2013.01); G03F 7/26 (2013.01); H01J 37/32889 (2013.01); H01L 21/02274 (2013.01); H01L 21/288 (2013.01); H01L 21/31144 (2013.01); H01L 21/6715 (2013.01); H01L 23/485 (2013.01); H01J 2237/3321 (2013.01); H01L 21/02035 (2013.01); H01L 21/02038 (2013.01); H01L 21/6723 (2013.01); H01L 21/67225 (2013.01); H01L 27/14683 (2013.01); H01L 2924/0002 (2013.01);
Abstract
Various techniques, methods, devices and apparatus are provided where an isolation layer is provided at a peripheral region of the substrate, and one or more metal layers are deposited onto the substrate.