The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 04, 2017

Filed:

Sep. 15, 2015
Applicant:

Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;

Inventors:

Hiroshige Hirano, Toyama, JP;

Kazuhiro Kaibara, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/522 (2006.01); H01L 23/532 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5226 (2013.01); H01L 21/48 (2013.01); H01L 23/5329 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 23/53238 (2013.01); H01L 24/45 (2013.01); H01L 2224/02166 (2013.01); H01L 2224/02372 (2013.01); H01L 2224/03 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/05093 (2013.01); H01L 2224/05556 (2013.01); H01L 2224/05557 (2013.01); H01L 2224/05558 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/05655 (2013.01); H01L 2224/45014 (2013.01); H01L 2224/45015 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/4847 (2013.01); H01L 2224/48747 (2013.01); H01L 2224/48755 (2013.01); H01L 2224/49107 (2013.01);
Abstract

A semiconductor device of the disclosure comprises: a first wiring disposed on a semiconductor substrate; a first insulating film disposed on the first wiring; a first via disposed in the first insulating film so as to be connected to the first wiring; a second wiring disposed on the first insulating film so as to be connected to the first wiring through the first via; a first organic insulating film disposed on the second wiring; a second via disposed in the first organic insulating film so as to be connected to the second wiring; a third wiring disposed on the first organic insulating film so as to be connected to the second wiring through the second via; and a second organic insulating film disposed on the first organic insulating film. A pad opening portion through which the third wiring is exposed is provided in the second organic insulating film, and the first via, the second via, the second wiring, and the third wiring are made of metal whose main component is copper.


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