The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 04, 2017

Filed:

Dec. 22, 2015
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

Rex Araneta Cari-an, Laguna, PH;

Ruby Ann Merto Camenforte, Pampanga, PH;

Roxanna Bauzon Samson, Benguet, PH;

Glenn Juan Morado, Pasig, PH;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/31 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49565 (2013.01); H01L 21/4842 (2013.01); H01L 21/561 (2013.01); H01L 21/565 (2013.01); H01L 23/3107 (2013.01); H01L 24/97 (2013.01); H01L 2924/14 (2013.01);
Abstract

A method of processing a leadframe strip having opposite first and second longitudinal ends and a plurality of leadframe panels positioned between the first and second longitudinal ends, each of the leadframe panels including an array of leadframe portions. The method includes saw cutting the leadframe rails and panels with a plurality of laterally extending saw cuts that each extend through the first and second rails and a panel connector portion of the leadframe strip positioned between adjacent panels of the leadframe strip. A method of reducing blade heating during leadframe strip singulation is described. Leadframe strip assemblies are also described.


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