The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 04, 2017
Filed:
Nov. 13, 2013
Nissan Motor Co., Ltd., Yokohama-shi, Kanagawa, JP;
Sanken Electric Co., Ltd., Niiza-shi, Saitama, JP;
Fuji Electric Co., Ltd., Kawasaki-shi, Kanagawa, JP;
Satoshi Tanimoto, Yokohama, JP;
Shinji Sato, Niiza, JP;
Hidekazu Tanisawa, Niiza, JP;
Kohei Matsui, Hino, JP;
NISSAN MOTOR CO., LTD., Yokohama-shi, JP;
SANKEN ELECTRIC CO., LTD., Niiza-shi, JP;
FUJI ELECTRIC CO., LTD., Kawasaki-shi, JP;
Abstract
A semiconductor device according to the present invention, having an Au-based solder layer () sandwiched between a semiconductor element () and a Cu substrate () made mainly of Cu, in which the semiconductor device includes: a dense metal film () which is arranged between the Cu substrate () and the Au-based solder layer (), and has fine slits () patterned to have a predetermined shape in a plan view; and fine structures () with dumbbell-like cross section, which have Cu and Au as main elements, and are each buried in the Cu substrate (), the Au-based solder layer (), and the fine slits () of the dense metal film ().