The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 04, 2017
Filed:
Jun. 03, 2016
Applicant:
International Business Machines Corporation, Armonk, NY (US);
Inventors:
Stephen W. Bedell, Wappingers Falls, NY (US);
Ning Li, White Plains, NY (US);
Katherine L. Saenger, Ossining, NY (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/30 (2006.01); H01L 21/46 (2006.01); H01L 21/31 (2006.01); H01L 21/469 (2006.01); H01L 23/34 (2006.01); H01L 21/683 (2006.01); B05D 1/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6835 (2013.01); B05D 1/005 (2013.01); H01L 2221/68381 (2013.01);
Abstract
Method for a controlled spalling utilizing vaporizable release layers. For example, a method comprises providing a base substrate, depositing a stressor layer and a vaporizable release layer on the base substrate, forming a flexible support layer on at least one of the stressor layer and the vaporizable release layer, spalling an upper portion of the base substrate, securing the spalled upper portion of the base substrate to a handle substrate, and vaporizing the vaporizable release layer.