The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 04, 2017
Filed:
Dec. 23, 2013
Applicant:
Lam Research Corporation, Fremont, CA (US);
Inventor:
Matthew J. Rodnick, San Jose, CA (US);
Assignee:
Lam Research Corporation, Fremont, CA (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/677 (2006.01);
U.S. Cl.
CPC ...
H01L 21/677 (2013.01); H01L 21/67742 (2013.01); H01L 21/67766 (2013.01); Y10S 294/902 (2013.01); Y10S 901/30 (2013.01);
Abstract
Provided herein are high coefficient of friction contact surfaces for transfer of substrates including semiconductor wafers. In certain implementations, the contact surfaces include microstructures that exploit intermolecular surface forces for increased adhesion and friction in the x-y direction during substrate transfer, while allowing easy release in the z-direction without tilting the substrate. Also provided are robot end effectors including the contact surfaces and related high-throughput transfer systems and methods.