The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 04, 2017

Filed:

Dec. 16, 2016
Applicant:

Bourns, Inc., Riverside, CA (US);

Inventors:

Gordon L. Bourns, Riverside, CA (US);

Stelar Chu, Ping-Cheng, TW;

Daniel E. Grindell, Calimesa, CA (US);

David Huang, Ping-Cheng, TW;

John Kelly, Co. Cork, IE;

Erik Meijer, Riverside, CA (US);

Assignee:

BOURNS, INC., Riverside, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01C 7/02 (2006.01); H01C 1/14 (2006.01); H01C 7/00 (2006.01); H01C 7/18 (2006.01); H01C 17/28 (2006.01);
U.S. Cl.
CPC ...
H01C 7/021 (2013.01); H01C 1/1406 (2013.01); H01C 7/005 (2013.01); H01C 7/028 (2013.01); H01C 7/18 (2013.01); H01C 17/281 (2013.01);
Abstract

Surface-mountable conductive polymer devices include a conductive polymer layer between first and second electrodes, on which are disposed first and second insulation layers, respectively. First and second planar conductive terminals are on the second insulation layer. A first cross-conductor connects the second electrode to the first terminal, and is separated from the first electrode by a portion of the first insulation layer. A second cross-conductor connects the first electrode to the second terminal, and is separated from the second electrode by a portion of the second insulation layer. In some embodiments, at least one cross-conductor includes a beveled portion through the first insulation layer to provide enhanced adhesion between the cross-conductor and the first insulation layer, while allowing greater thermal expansion without undue stress. In other embodiments, these advantages are achieved by having at least one cross-conductor in physical contact with a metallized anchor pad on the first insulation layer.


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