The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 04, 2017

Filed:

Jul. 19, 2013
Applicant:

Nec Corporation, Tokyo, JP;

Inventors:

Arihiro Matsunaga, Tokyo, JP;

Minoru Yoshikawa, Tokyo, JP;

Hitoshi Sakamoto, Tokyo, JP;

Akira Shoujiguchi, Tokyo, JP;

Masaki Chiba, Tokyo, JP;

Kenichi Inaba, Tokyo, JP;

Assignee:

NEC Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F25B 39/02 (2006.01); H01L 23/427 (2006.01); B23P 15/26 (2006.01);
U.S. Cl.
CPC ...
F25B 39/028 (2013.01); B23P 15/26 (2013.01); H01L 23/427 (2013.01); H01L 2924/0002 (2013.01); Y10T 29/49359 (2015.01);
Abstract

In order to maintain a high cooling capability even in a case where a heating element has a lower calorific value, a boiling section of a heat receiving section in a phase change cooling apparatus includes a comb-shaped structure and a porous layer provided on a bottom portion of the comb-shaped structure between fins of the comb-shaped structure. With such a boiling section, a liquid film of a liquid phase refrigerant is forcedly made thinner. Thus, the liquid phase refrigerant is changed in phase into a gaseous phase refrigerant even in a case of a small difference between the temperature of the gaseous phase refrigerant and the temperature of the heat receiving surface.


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