The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 04, 2017

Filed:

May. 01, 2014
Applicant:

Honeywell International Inc., Morristown, NJ (US);

Inventors:

Josef Novotny, Kuncina, CZ;

Jaromir Cechak, Brno, CZ;

Jiri Sapak, Brno, CZ;

Eugene J. Takach, Eden Prairie, MN (US);

Reed Bisson, Minnetonka, MN (US);

Assignee:

Honeywell International Inc., Morris Plains, NJ (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 5/00 (2006.01); F24F 11/053 (2006.01); G05D 23/19 (2006.01); F24F 11/00 (2006.01); H02H 9/04 (2006.01); H05K 7/14 (2006.01); H05K 13/00 (2006.01); H05K 1/02 (2006.01); F21V 8/00 (2006.01);
U.S. Cl.
CPC ...
F24F 11/053 (2013.01); F24F 11/0086 (2013.01); G05D 23/19 (2013.01); G05D 23/1904 (2013.01); G05D 23/1917 (2013.01); G05D 23/1919 (2013.01); H02H 9/04 (2013.01); H05K 7/1427 (2013.01); H05K 13/0023 (2013.01); F24F 2011/0091 (2013.01); G02B 6/0031 (2013.01); G02B 6/0088 (2013.01); H05K 1/0215 (2013.01); Y10T 29/49117 (2015.01); Y10T 29/49126 (2015.01);
Abstract

An HVAC Controller may include a first sub-assembly and a second sub-assembly releasably engageble with the first sub-assembly. The first sub-assembly may include a first housing and a printed circuit board capable of being secured relative to the first housing and capable of providing one or more signals. The second sub-assembly may include a second housing and a second printed circuit board capable of being secured relative to the second housing and capable of receiving the one or more signals from the first printed circuit boards when the first sub-assembly is releasably engaging the second sub-assembly. The first printed circuit board and the second printed circuit board each may have one or more component mounted on sides facing one another, the components each extending a distance. The sum of the distances may be greater than a distance spacing the facing sides of the printed circuit boards.


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