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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9695345 B1

PDFFull Text
Date of Patent:
Jul. 04, 2017

Filed:

Oct. 28, 2008

Dicing die bonding film having excellent burr property and reliability and semiconductor device using the same

Applicants:

Hyun Jee Yoo, Daejeon, KR;

Jang Soon Kim, Daejeon, KR;

Jong Wan Hong, Daejeon, KR;

Hyo Soon Park, Daejeon, KR;

Dong Han Kho, Daegu, KR;

Inventors:

Hyun Jee Yoo, Daejeon, KR;

Jang Soon Kim, Daejeon, KR;

Jong Wan Hong, Daejeon, KR;

Hyo Soon Park, Daejeon, KR;

Dong Han Kho, Daegu, KR;

Assignee:

LG Chem, Ltd., Seoul, KR;

Attorney:

Dentons US LLP

Primary Examiner:

Frank D Ducheneaux

Int. Cl.
CPC ...
C09J 163/00 (2006.01); C09J 133/08 (2006.01); C09J 7/02 (2006.01); C08K 5/13 (2006.01); C08K 5/3442 (2006.01); C08K 3/36 (2006.01); C09J 133/06 (2006.01); C08K 5/3445 (2006.01); C08K 5/00 (2006.01); C08G 59/62 (2006.01); H01L 21/683 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
C09J 163/00 (2013.01); C08G 59/621 (2013.01); C08K 3/36 (2013.01); C08K 5/0025 (2013.01); C08K 5/13 (2013.01); C08K 5/3445 (2013.01); C09J 133/068 (2013.01); H01L 21/6836 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); H01L 24/83 (2013.01); C09J 7/0203 (2013.01); C09J 7/0217 (2013.01); C09J 2201/36 (2013.01); C09J 2201/606 (2013.01); C09J 2203/326 (2013.01); C09J 2205/102 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/85 (2013.01); H01L 24/94 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68336 (2013.01); H01L 2221/68377 (2013.01); H01L 2221/68381 (2013.01); H01L 2224/27003 (2013.01); H01L 2224/27436 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/29387 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/83191 (2013.01); H01L 2224/83862 (2013.01); H01L 2224/94 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/0615 (2013.01); H01L 2924/351 (2013.01); H01L 2924/3511 (2013.01); Y10T 428/287 (2015.01); Y10T 428/2891 (2015.01); Y10T 428/31515 (2015.04);
Abstract

The present invention relates to a dicing die bonding film employed in a semiconductor packaging process, and a semiconductor device using the same. The dicing die bonding film is configured such that a ratio X/Y of adhesive power X between the wafer and the adhesive layer of the die bonding portion to tacky power Y between the die bonding portion and the tacky layer of the dicing portion is 0.15 to 1, and the adhesive layer of the die bonding portion has a storage modulus of 100 to 1000 MPa at a normal temperature. The dicing die bonding film according to the present invention reduces burr generation in dicing process, and thereby preparing a semiconductor device having excellent reliability without inferiority caused by bad connection reliability due to the burr covering a bonding pad.

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