The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 04, 2017

Filed:

Nov. 18, 2014
Applicant:

Huhtamaki, Inc., De Soto, KS (US);

Inventors:

Keegan Y. Yang, Winslow, ME (US);

Donald V. Breton, N. Vassalboro, ME (US);

James Michaud, Albion, ME (US);

Assignee:

HUHTAMAKI, INC., De Soto, KS (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 59/02 (2006.01); D21J 7/00 (2006.01); B65D 1/34 (2006.01); B29L 31/00 (2006.01); B29C 33/42 (2006.01); B65D 85/30 (2006.01); B29C 33/10 (2006.01);
U.S. Cl.
CPC ...
B29C 59/02 (2013.01); B65D 1/34 (2013.01); B29C 33/10 (2013.01); B29C 33/428 (2013.01); B29L 2031/772 (2013.01); B65D 85/30 (2013.01); B65D 2203/12 (2013.01); Y10T 428/24802 (2015.01);
Abstract

A system and method for constructing a molded fiber article capable of having detailed indicia embossed thereon is provided. A molded fiber article having a smooth surface with detailed indicia is also provided. The system includes using a wire mesh structure coupled with an embossing plate such that the embossing plate imparts a smooth surface with indicia onto the molded fiber article during formation. The smooth surface if the embossing plate allows for greater detail than that of the textured surface created by the wire mesh structure. The system may also include a forming die that generally conforms to the wire mesh structure to facilitate formation of the molded fiber article. The wire mesh structure may include a recessed area for housing the embossing plate, which may be attached to the wire mesh structure using fasteners and a backing plate.


Find Patent Forward Citations

Loading…