The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 04, 2017
Filed:
Feb. 26, 2016
Applicant:
Sii Semiconductor Corporation, Chiba-shi, Chiba, JP;
Inventors:
Yasuo Terui, Chiba, JP;
Masaru Akino, Chiba, JP;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/56 (2006.01); B29C 45/14 (2006.01); B29C 45/40 (2006.01); B29C 45/32 (2006.01); B29L 31/34 (2006.01); B29K 101/10 (2006.01); B29K 101/12 (2006.01);
U.S. Cl.
CPC ...
B29C 45/14065 (2013.01); B29C 45/14655 (2013.01); B29C 45/32 (2013.01); B29C 45/401 (2013.01); H01L 21/565 (2013.01); B29C 2045/14147 (2013.01); B29K 2101/10 (2013.01); B29K 2101/12 (2013.01); B29L 2031/3406 (2013.01); B29L 2031/3481 (2013.01);
Abstract
A semiconductor device manufacturing apparatus for encapsulating with a resin a semiconductor chip includes upper and lower molds configured to receive therebetween a lead frame on which the semiconductor chip is mounted. A positioning pin provided to the lower mold is configured to be received by a positioning hole provided in the lead frame. Ejector pins provided in proximity to the positioning pin are arranged so as to be symmetrical with respect to the positioning pin.